Routing High-Speed differential signals on top and bottom?
I plan to design aboard with 10 Gbps (~35 ps rise/fall time) transceiver.
TI High-Speed InterfaceLayout Guidelines recommend:
"When possible,route high-speed differential pair signals on the top or bottom layer of thePCB with an adjacent GND layer. TI does not recommend stripline routing of thehigh-speed differential signals.".
Do you think this is agood rule of thumb?
On one side this willavoid via stubs, on the other hand the signal goes to the full via lenght (inmy case 60 mil) which will cause more insertion loss compared to a short via to the next signal layer.
Assumed that you have enough space to route only on top and bottom:
Are there otherdisadvantages when using stripline routing / advantages of microstrip line routingthat can explain this recommendation?
thank you for your feedback
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