DesignCon 2017 Call for Abstracts is Now Open
DesignCon 2017 Call for Abstracts Now Open!
The DesignCon 2017 Call for Technical Papers, Panels and Tutorials is open!
DesignCon gives the chip, board and systems design engineering community a
unique opportunity to gather for three days of learning the latest design
techniques, methodologies and tools around SI and PI, high-speed serial design,
PCB design tools, test & measurement and more.
This 2017 technical conference consists of 14 tracks:
1. Overcoming Chip & Package Challenges in Signal/Power Integrity
2. Analog and Mixed-Signal Modeling and Simulation Solutions
3. Integrating Photonic and Electronic Signaling
4. System Co-Design Modeling, Correlation, and Simulation
5. Advances in Materials and Processing for PCBs, Modules and Packages
6. Applying PCB Design and Simulation Tools
7. Advanced IO Interface Design for Memory and 2.5D/3D/SiP Integrations
8. Optimizing High-Speed Serial Design
9. Measuring and Simulating Jitter, Noise, and Timing in Serial Links to
Minimize BER
10. High-speed Signal Processing for Equalization and Coding
11. Power Integrity in Power Distribution Networks
12. Electromagnetic Compatibility/Mitigating Interference
13. Apply Test and Measurement Methodology
14. Modeling and Analysis of Interconnects
http://www.designcon.com/santaclara/call-for-abstracts/
Martin Rowe
Senior Technical Editor, Test & Measurement
1-212-600-3403
martin.rowe@xxxxxxx
EDN Test & Measurement Design Center
EE Times Test & Measurement DesignLine
@measurementblue
@TMW_Community
martin.rowe
4 years 11 months 5 days